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The Probe Card Market was USD 4.44 Bn in 2024 and is expected to expand at a CAGR of 6.9 % from 2025 to 2032, reaching USD 7.58 Bn by 2032. Probe cards are essential for guaranteeing the performance and quality of semiconductor devices at these small nodes. The continued trend toward miniaturization and new semiconductor technologies (e.g., 5nm and 3nm nodes) necessitates precision and accuracy in testing. vehicle adoption continues to emerge in the industry, the demand for more and more advanced semiconductor chips is increasing. They are mainly used in power management and battery control systems. Semiconductor manufacturers making large investments in R&D activities, especially next-gen chips, are primarily contributing to the high demand for precision probe cards to test and validate new designs. Technological advancements in the probe card itself (specifically in contact material, automation, and test speeds) are propelling the growth of the probe card market. The North American probe card market is expected to grow at a CAGR of 10.7%.
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Probe Card Market Segmentation
By Type: Epoxy Probe Cards are typically less complex and are more commonly used for mass production. They are suitable for high-density testing where simultaneous access to multiple test points is required. High-density applications typically use vertical probe cards that are defined by vertical probes. Array Probe Cards represent a high parallelism testing artifact that allows testing fairly fast.
By Application: DRAM test probes cards are designed to test large quantities of memory chips. Flash memory probe cards Short for DJ-TSM(Memory Bio). In foundry and logic applications, probe cards are utilized to test both the performance and functionality of these complex chips. Measurement of electrical features of the semiconductor device is the main part of parametric testing.
Probe Card Market Regional Analysis
North America (United States): North American probe card market value (USD Million), country and from 2020 to 2027; United States (2059), (USD Million) Especially, the investments in semiconductor factories in the U.S., such as Texas and Arizona to promote the use of probe cards. Key contributors in the U.S. are companies like FormFactor, Inc., Micronics Japan Co., Ltd., and Technoprobe S.p.A.
Germany: The German probe card market is expected to grow to USD 1.5 billion by 2024. Key players of the German Probe Card Market include FormFactor, Inc., Micronics Japan Co., Ltd. (MJC), Technoprobe S.p.A., Japan Electronic Materials Co., Ltd. (JEM), Advantest Corporation, Microprobe, STAr Technologies & LTX-Credence.
Asia-Pacific: Asia-Pacific region is the largest holder of the probe card market. Some of the biggest semiconductor manufacturers in the world are located in the APAC region, especially in China, South Korea, Japan, and Taiwan. Some of the significant manufacturers are TSMC (Taiwan), Samsung Electronics (South Korea), and SMIC (China), in which the production of probe cards, is constantly increasing.
Probe Card Market Competitive Landscape
FormFactor, Inc.: For about USD 200 million, FormFactor has bought MicroProbe, Inc., one of the leading providers of probe cards. Cascade Microtech acquired FormFactor for USD 200 million.
Technoprobe S.p.A.: Technoprobe purchased Microfabrica, Inc., a California company, in 2021. In 2021, Technoprobe acquired Atotech’s Semiconductor Division.
FEINMETALL GmbH: FEINMETALL has purchased Microfabrica’s probe card technology. FEINMETALL GmbH also purchased Test Systems Technology GmbH (TST).
Recent Developments:
- MEMS (Micro-Electro-Mechanical Systems)-based probe cards are growing in capability and are being increasingly used to test fine-pitch and high-frequency devices.
- Vertical probe cards are rapidly becoming popular for high-density applications in which large numbers of contacts are needed, such as for memory devices (including DRAM) testing.
Conclusion
- The significant trend in the market is that manufacturers are focusing on providing all-purpose probe cards that meet specific customer requirements that involve the integration of probe cards with ATE for reduced test time.
- New packaging, such as advanced packaging and 3D ICs, is also creating markets for probe cards as it requires solutions for testing stacked die and multi-chip modules.
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